Zeevo today announced the production release of industry's first Bluetooth 1.2 compliant single chip solution, a significant milestone for a fabless RF semiconductor company.
Zeevo delivers a highly integrated Bluetooth system-on-a-chip solution combined with innovative LTCC packaging technology that together provide customers all the benefits of an RF module at significantly lower costs. The ZV4002 single-chip IC is fabricated in TSMC's 0.18u RFCMOS process. Zeevo also relies on proven test and assembly facilities such as ASE in Taiwan that provide the highest quality, on-time delivery and support.
"We are very pleased to be first to market with a qualified Bluetooth 1.2 device. This achievement demonstrates the commitment and dedication of Zeevo to innovate and establish itself as a leader in Bluetooth technology and products," stated Scott Macomber, President and CEO of Zeevo. "The significant customer interest in the ZV4002 also highlights our increasing momentum in the Bluetooth market."
The ZV4002 is a single chip digital baseband and RF solution with the required external RF components integrated into an LTCC based micro-module. This micro-module approach allows the device to be placed directly on the motherboard, while eliminating the manufacturing variability associated with discrete RF components. The ZV4002 supports all Bluetooth 1.2 features such as Fast Connect and AFH as well as all optional features such as e-SCO. The ZV4002 also supports multiple co-existence solutions with WLAN.
Zeevo provides system-on-chip solutions for Bluetooth and other wireless communications applications.