Yenra : Wireless : Envara EN303 RF Chip : Envara's EN303 RF Chip Offers Multi-Mode IEEE 802.11a+b+g Interoperability On A Single Chip

On July 8, 2002, Envara announced that it is sampling engineering silicon for its multi-mode IEEE 802.11a+b+g EN303 RF chip. The EN303 is the world's first multi-mode IEEE 802.11a+b+g on a single RF chip, offering interoperability with the dominant IEEE 802.11a and IEEE 802.11b standards as well as the emerging IEEE 802.11g draft that proposes higher data rates by employing OFDM in the 2.4GHz band. OEM's will benefit from this advanced technology that enables interoperability between the dominant WLAN standards and works over all internationally defined WLAN spectral bands, including the additional 5GHz band recently proposed in Japan around 4.95 GHz.

IEEE 802.11 a+b+g Capability Delivers Global Interoperability
Given that the transition from 2.4GHz to 5GHz systems will not be immediate interoperability is a significant feature - freeing mobile users to access necessary data in any IEEE 802.11 wireless networking environment. The EN303's multi-mode IEEE 802.11a+b+g capability promises interoperability no matter what wireless networking environment users may enter, while its coverage of all of the internationally allocated frequency spectra in both the 2.4GHz and 5GHz bands ensures transparent worldwide operation. ''We expect to see a great deal of interest in multi-mode WLAN chips for the foreseeable future,'' said Craig J. Mathias, Principal with the wireless advisory firm Farpoint Group. ''Customers are looking for flexibility as WLAN technology continues to evolve.''

Using Silicon Germanium Results in RF Technology Breakthrough
The small die size Silicon Germanium (SiGe) chip has demonstrated extremely good performance in its first engineering silicon samples, which is a tremendous technological achievement for Envara's expert RF professionals as well as proof of the maturity and quality to IBM's SiGe process and modeling. /P>

Features of the EN303 chip:
The EN303 chip is a highly integrated WLAN solution that integrates almost all the required components onto a single chip through innovative design and advanced, patent pending technology. The minimization of external components while enhancing performance significantly reduces both chip and BOM costs for OEM customers. A brief list of the primary features and advantages offered by the EN303 include:

The EN303 is a unique combination of RF design and technology that enables a first of its kind, low-power, low-cost, multi-mode IEEE 802.11a+b+g, single chip solution capable of transparently operating anywhere worldwide.