PHYSICAL VAPOR DEPOSITION: UNDERSTAND AND QUALIFY THIN FILMS
Editable planning/verification record — Yenra
Updated: October 2, 2026
Article: https://yenra.com/pvd/

Purpose: Explain key PVD choices and build a film-requirements and measurement plan.
Intended reader: Engineers new to semiconductor deposition and teams reviewing thin-film qualification evidence.

HOW TO USE
Save a working copy. Enter the actual specification, units, assumptions and evidence references in each field. Preserve original observations and record changes. Have the responsible reviewer resolve missing or conflicting requirements before release. Examples below are fictional teaching inputs, not process settings or acceptance standards.

RECORD
1. Film function, stack, substrate, pattern geometry and thermal limits:
   ____________________________________________________________

2. Material/target/source identity and deposition method:
   ____________________________________________________________

3. Approved recipe revision, chamber state and wafer position:
   ____________________________________________________________

4. Thickness target/range in nm and specified map/edge exclusion:
   ____________________________________________________________

5. Uniformity formula, map values and measurement uncertainty:
   ____________________________________________________________

6. Electrical, composition, adhesion and step-coverage requirements:
   ____________________________________________________________

7. Representative patterned features, cross-sections and witness correlation:
   ____________________________________________________________

8. Repeat-run evidence, chamber maintenance triggers and release decision:
   ____________________________________________________________


WORKED EXAMPLE AND LIMITS
Fictional five-site thicknesses: 98, 100, 102, 99, 101 nm. Mean = 100 nm. With U = (maximum - minimum)/(2 x mean) x 100%, U = 2%. Peak-to-peak range divided by mean is 4%. Retain the formula and map; neither five points nor a blanket wafer demonstrates coverage inside a patterned feature.

REVIEW
Prepared by / date: ____________________
Reviewed by / date: ____________________
Open issues, responsible owner, due date: ____________________
Approved next action and evidence: ____________________

SOURCE CONTEXT
These primary references support the linked article. Use exact applicable product, contract, and document versions for operational work.
Kurt J. Lesker's deposition overview
https://www.lesker.com/process-equipment-division/thin-film-deposition-techniques-capabilities.cfm
material deposition chart
https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm?pgid=0
KLA's metal-film mapping note
https://www.kla.com/wp-content/uploads/Filmetrics_AppNote_R50_Metal_Films.pdf

Return to the guide: https://yenra.com/pvd/