PACKAGING LITHOGRAPHY: ALIGN PATTERNS ON REAL SUBSTRATES
Editable planning/verification record — Yenra
Updated: October 2, 2026
Article: https://yenra.com/packaging-lithography/

Purpose: Prepare a packaging-patterning brief that links feature dimensions, overlay, resist thickness and substrate condition to trial evidence.
Intended reader: Engineers and technical buyers evaluating lithography for semiconductor packaging.

HOW TO USE
Save a working copy. Enter the actual specification, units, assumptions and evidence references in each field. Preserve original observations and record changes. Have the responsible reviewer resolve missing or conflicting requirements before release. Examples below are fictional teaching inputs, not process settings or acceptance standards.

RECORD
1. Packaging route, wafer/panel format, carrier and material stack:
   ____________________________________________________________

2. Pattern revision, feature sizes, pitch and critical landing geometry in micrometres:
   ____________________________________________________________

3. Substrate bow, topography and measured die-position variation:
   ____________________________________________________________

4. Resist type, thickness, coating/bake and development document revisions:
   ____________________________________________________________

5. Alignment targets, distortion corrections and exposure method:
   ____________________________________________________________

6. Trial locations, exposure/focus or gap variables and inspection methods:
   ____________________________________________________________

7. Critical dimensions, residual overlay, profile and post-transfer continuity:
   ____________________________________________________________

8. Failure distribution, repeat trials and accepted operating window:
   ____________________________________________________________


WORKED EXAMPLE AND LIMITS
Fictional one-axis landing calculation: a 20 micrometre opening is centered on a 40 micrometre pad, giving 10 micrometres nominal margin per side. A measured 6 micrometre offset leaves 4 micrometres on the nearer side; an 11 micrometre offset gives -1 micrometre, so the opening extends past the pad in this simplified geometry. Include size tolerances, the other axis, distortion and process variation before making a real acceptance decision.

REVIEW
Prepared by / date: ____________________
Reviewed by / date: ____________________
Open issues, responsible owner, due date: ____________________
Approved next action and evidence: ____________________

SOURCE CONTEXT
These primary references support the linked article. Use exact applicable product, contract, and document versions for operational work.
maskless-lithography white paper
https://www.evgroup.com/fileadmin/media/products/lithography/lithoscale/evg_lithoscale/EVG_White_Paper_LITHOSCALE.pdf

Return to the guide: https://yenra.com/packaging-lithography/